Hot Melt Adhesive Film For Bonding Phenolic Aldehyde Panel
Phenolic resin materials (including phenolic boards, phenolic fiberglass boards, and thermal insulation foam boards) are high-density thermosetting rigid materials. The Hot Melt Adhesive Film for bonding phenolic panels provides strong adhesion on dense, smooth, low-surface-energy substrates, while offering excellent heat resistance, acid and alkali resistance, flame retardancy, and electrical insulation performance...
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Product Introduction
Introduction
Phenolic resin (phenolic board, phenolic fiberglass board, thermal insulation foam board) is a high-density rigid thermosetting material. It features dense & smooth surface, low surface energy, high temperature resistance, acid & alkali resistance, flame retardancy and insulation. Due to inert surface with weak polarity, it is difficult to bond and easy to peel off. Compared with liquid glue, hot melt adhesive film is the most stable and eco-friendly bonding solution without corrosion and brittleness.
Technical Parameters
一,Product Composition
100% polyolefin resin
二,Property Index
Appearance: semi transparent thin film
Softening Point(Ring and Ball) : 170±5℃
三,Specification
The regular adhesive film thickness: WT-E25-1 0.05mm WT-E25-1 0.10mm
Special specifications can be customized.
四,The Package
Rolled, 500-1000 meters per roll.
五,The Product Applications
Bonding Difficulties
Dense and smooth surface leads to poor adhesion;
Low-temperature adhesive films fail to resist high temperature;
Hard substrate requires high-rigidity adhesive film;
Release agent and dust on board seriously reduce bonding strength.
Product Application
The hot melt adhesive film for phenolic board can be used for bonding materials such as fiber fabrics, plastics, metals, wood, ceramics, etc. It is widely applied in the construction and home decoration industry, labeling, interior parts of the automotive industry, electronics industry, packaging industry, communication industry, etc.
Instructions for Use
1)The operating temperature of this phenolic sheet hot melt bonding film is 160-200℃. The surface of the objects to be bonded should be dry and without any oil stainless. if necessary, the surface should be roughened.
2)Place the adhesive film on the object to be bonded, heat it to above the melting temperature, apply appropriate pressure, peel off the release paper, then heat it to above the melting temperature again, and then laminate the other bonding surface, apply appropriate pressure, and it will cure instantly during cooling to complete the bonding.
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