Hot Sealing Adhesive Film For Bonding Copper
Hot Melt Adhesive Film for Copper provides strong and reliable bonding for copper and copper alloys, including copper foil, plates, and pipes. It features excellent adhesion strength, heat resistance, insulation performance, and environmentally friendly processing. Compatible with automated production lines, it is widely used in electronics, new energy, automotive, and precision manufacturing industries...
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Product Introduction
Introduction
Hot melt adhesive film can bond copper and copper alloys (copper foil, copper plate, copper pipe) efficiently, featuring high bonding strength, temperature resistance, insulation performance and environmental friendliness. It is fully compatible with automated production lines and widely applied in electronics, new energy, automobile and precision manufacturing industries.
Technical Parameters
Product Physical Property Sheets
|
Physical property |
Performance Index |
Units |
Testing Method |
|
Melting Point |
115-125 |
℃ |
|
|
Softening Point(Ring and Ball) |
138 |
℃ |
Ring and Ball |
|
Melt flow index |
8.64 |
g/10mins |
2.16KG,150℃ |
Products Description
Hot Sealing Adhesive Film for Bonding Copper Materials is specially designed for reliable lamination and sealing of copper and copper alloy products. With excellent adhesion performance, the film forms a strong and stable bond under heat and pressure, ensuring long-lasting durability and high bonding efficiency.
Product Applications
The adhesive film features outstanding heat resistance, electrical insulation performance, corrosion resistance, and environmental friendliness. Compared with traditional liquid adhesives, it offers solvent-free processing, clean operation, and easy integration into automated production lines.
Hot Melt Adhesive Film for Sticking The Copper is widely used for bonding copper foil, copper plates, copper tubes, and composite copper materials in electronics, lithium battery production, new energy equipment, automotive components, electrical insulation systems, and precision industrial manufacturing applications.
Directions for Use
Operating temperature: 80–120℃. The PE film with heat seal adhesive surfaces to be bonded must be dry and free of oil. Roughening is recommended if necessary.
Place the adhesive film on the substrate and heat above melting temperature with proper pressure. Peel off the release liner, heat again above melting temperature, laminate with the other surface, apply proper pressure, and it will cure instantly during cooling to complete bonding.
Product Packaging
100 ㎡ per roll; packed in woven bags lined with plastic film or carton boxes.
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